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RISSpecial Issue on InterPACK 2019 – Part 1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We hope that you find the content of the Special Issues useful and wish you the very best.The two-part 2019 InterPACK Special Issues of the ASME Journal of Electronic Packaging (JEP) was developed from manuscripts submitted ...
Special Section on InterPACK2021
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It ...
Special Issue on InterPACK2020
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The microelectronics packaging industry is facing challenges to meet demanding performance and functional needs of modern microprocessors, radio frequency components, and power electronic devices for various product segments ...
Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the advent of gallium nitride (GaN) as an enabling material system for the solid-state lighting industry, high-power and high-brightness light-emitting diodes (LEDs) with wavelengths ranging from near ultraviolet to ...
A System to Package Perspective on Transient Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications ...
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasing demand for tightly integrated gallium nitride high electron mobility transistors (HEMT) into electronics systems requires accurate thermal evaluation. While these devices exhibit favorable electrical ...
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power of power electronics beyond current ...
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ...
Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ...
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gallium nitride (GaN) has emerged as one of the most attractive base materials for next-generation high-power and high-frequency electronic devices. Recent efforts have focused on realizing vertical power device structures ...