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Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in ...
Mechanics of Interfacial Delamination in Epidermal Electronics Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via ...
A Simply Analytic Study of Buckled Thin Films on Compliant Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Buckling of stiff thin films on compliant substrates enables many new applications, such as stretchable electronics. Song et al. [2008, “Buckling of a Stiff Thin Film on a Compliant Substrate in Large Deformation,†...
Mechanics of Solar Module on Structured Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the islandinterconnect design, the device islands connected by interconnects are mounted on a soft elastomeric substrate. The outofplane motion of interconnects accommodates the deformation applied to the system, enabling ...
Design of the Magnetic Stamp Film for Electromagnetic-Assisted Transfer Printing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a critical step to integrate micro-nano electronic components on the soft substrate, transfer printing allows the facile fabrication of flexible electronics. The key to a successful transfer printing process is to ...
A Finite Deformation Mechanics Theory for Kinetically Controlled Transfer Printing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The widely used steadystate energy release rate G = F/w is extended to account for the elastic energy of deformed compliant stamps, e.g., lowmodulus poly(dimethyl siloxane) (PDMS). An analytical expression for the ...
Design and Analysis of Magnetic-Assisted Transfer Printing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a versatile yet simple technique, transfer printing has been widely explored for the heterogeneous integration of materials/structures, particularly important for the application in stretchable and transient electronics. ...