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    Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration 

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 002:;page 20801
    Author(s): Gao, Yuyan; Cheng, Huanyu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in ...
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    Mechanics of Interfacial Delamination in Epidermal Electronics Systems 

    Source: Journal of Applied Mechanics:;2014:;volume( 081 ):;issue: 004:;page 44501
    Author(s): Cheng, Huanyu; Wang, Shuodao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via ...
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    A Simply Analytic Study of Buckled Thin Films on Compliant Substrates 

    Source: Journal of Applied Mechanics:;2014:;volume( 081 ):;issue: 002:;page 24501
    Author(s): Cheng, Huanyu; Song, Jizhou
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Buckling of stiff thin films on compliant substrates enables many new applications, such as stretchable electronics. Song et al. [2008, “Buckling of a Stiff Thin Film on a Compliant Substrate in Large Deformation,â€‌ ...
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    Mechanics of Solar Module on Structured Substrates 

    Source: Journal of Applied Mechanics:;2014:;volume( 081 ):;issue: 006:;page 64502
    Author(s): Liu, Zhuangjian; Cheng, Huanyu; Wu, Jian
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the islandinterconnect design, the device islands connected by interconnects are mounted on a soft elastomeric substrate. The outofplane motion of interconnects accommodates the deformation applied to the system, enabling ...
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    Design of the Magnetic Stamp Film for Electromagnetic-Assisted Transfer Printing 

    Source: Journal of Applied Mechanics:;2021:;volume( 088 ):;issue: 007:;page 071006-1
    Author(s): Yu, Qingmin; Li, Anran; Yu, Xudong; Zhou, Honglei; Cheng, Huanyu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As a critical step to integrate micro-nano electronic components on the soft substrate, transfer printing allows the facile fabrication of flexible electronics. The key to a successful transfer printing process is to ...
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    A Finite Deformation Mechanics Theory for Kinetically Controlled Transfer Printing 

    Source: Journal of Applied Mechanics:;2013:;volume( 080 ):;issue: 006:;page 61023
    Author(s): Feng, Xue; Cheng, Huanyu; Bowen, Audrey M.; Carlson, Andrew W.; Nuzzo, Ralph G.; Rogers, John A.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The widely used steadystate energy release rate G = F/w is extended to account for the elastic energy of deformed compliant stamps, e.g., lowmodulus poly(dimethyl siloxane) (PDMS). An analytical expression for the ...
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    Design and Analysis of Magnetic-Assisted Transfer Printing 

    Source: Journal of Applied Mechanics:;2018:;volume( 085 ):;issue: 010:;page 101009
    Author(s): Yu, Qinming; Chen, Furong; Zhou, Honglei; Yu, Xudong; Cheng, Huanyu; Wu, Huaping
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As a versatile yet simple technique, transfer printing has been widely explored for the heterogeneous integration of materials/structures, particularly important for the application in stretchable and transient electronics. ...
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