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RISPublisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407.
Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, the elastic–plastic properties of the printed interconnects on a glass substrate with Ag-filled polymer-conductor ink are evaluated through a theoretical framework based on finite element (FE) modeling of ...