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    Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review 

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001:;page 10801
    Author(s): Panigrahy, Asisa Kumar; Chen, Kuan-Neng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Arguably, the integrated circuit (IC) industry has received robust scientific and technological attention due to the ultra-small and extremely fast transistors since past four decades that consents to Moore's law. The ...
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