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RISTransient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient ...
Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, was performed in this work to investigate ...