Abstract: Spectral analysis has been widely applied to the detection of bifurcation and the determination of the extent to which dynamic instability and chaotic responses develop. However, because spectral ...

Abstract: A noncontact, laser-optic based laser ultrasonic technique referred to as the thermo-acousto-photonic nondestructive evaluation (TAP-NDE) was utilized to investigate bond integrity and localized ...

Abstract: The physics explored in this investigation enables short-time scale dynamic phenomenon to be correlated with package failure modes such as solder ball cracking and interlayer debond. It is found ...

Abstract: The demand for higher clock speed and larger current magnitude in high-performance flip chip packaging configurations of small footprint has raised the concern over rapid thermal transients and ...