Abstract: The failure of electrical devices associated with solder joints has become one of the most critical reliability issues for surface-mounted devices. Solder joint reliability performance has been ...

Abstract: The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and ...

Abstract: Thin film metallizations are one of the most important interconnects in large-scale integrated circuits. They are covered by substrates and passivation films. Large hydrostatic (mean) tension ...

Abstract: Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis ...