Abstract: The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics ...

Abstract: Large area substrate processing is a key solution for improving the productivity of multi-chip module deposition (MCM-D) technology. This project is focused on high temperature low modulus polymeric ...

Abstract: This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally ...