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RISMeasurement of High Performance Thermal Interfaces Using a Reduced Scale Steady State Tester and Infrared Microscopy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface materials (TIMs) have reached values approaching the measurement uncertainty of standard ASTM D5470 based testers of approximately آ±1 أ— 10−6 m2 K/W. This paper presents a miniature ASTMtype ...
A System to Package Perspective on Transient Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications ...
Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing ...
Special Issue on InterPACK 2018
Publisher: American Society of Mechanical Engineers (ASME)
Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates ...