Abstract: This paper addresses the gap between optimistic and pessimistic analytical predictions of the reliability of microelectronic structures using the example of single chip ceramic packages. The ...

Abstract: A new test to measure the adhesion of thin polymeric coatings (the so-called “edge delamination test”) has been recently proposed by Shaffer et al. (1993), where the authors translate the test ...

Abstract: The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed.

Abstract: High impact of peeling stresses on solder joint reliability, and how to account for these stresses in failure criteria, are discussed. [S1043-7398(00)00803-3]

Abstract: An experiment with solder joints of thin plastic packages, cycled between −10° and 110°C, has demonstrated that the majority of solder joint failures occurred at the low temperatures. ...

Abstract: Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips.