Search
CSV
RISExperimental Characterization of the Vertical and Lateral Heat Transfer in Three Dimensional Stacked Die Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present the experimental characterization of threedimensional (3D) packages using a dedicated stackable test chip. An advanced complementary metal oxide silicon (CMOS) test chip with programmable power ...
Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of line (BEOL) for the experimental thermal characterization of the intertier thermal resistance ...
Edge Trimming Induced Defects on Direct Bonded Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The diamond abrasive process which is applied onto the silicon wafer edge, the so called “edge trimming,” is an important step in three-dimensional microelectronics processing technology, due to the significant thickness ...