Abstract: In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresistive stress sensors for microelectronic packaging can be simpler, more ...

Abstract: Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with ...

Abstract: Based on experimental data, a simple R–C (thermal resistance–heat capacitance) model with software precaution strategies are proposed in this paper to predict the steady-state temperature of the ...

Abstract: Stress measurements in microelectronic packaging through piezoresistive sensors take the advantage of both in-situ and nondestructive. In this study, test chips with both p-type and n-type ...

Abstract: In our previous works, the piezoresistive sensors have been demonstrated to be accurate and efficient tools for stress measurements in microelectronic packaging. In this study, we first designed ...

Abstract: Due to the carrier mobility changes with the mechanical loading and its small size, the MOSFET (metal-oxide-semiconductor field-effective-transistor) has the potential to be a suitable chip stress ...