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    Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003:;page 299
    Author(s): Ben Ting; Vincent P. Manno
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser hammering (LH) is a process used in the manufacturing of butterfly optoelectronic packages to correct laser-to-fiber misalignment that occurs when the semiconductor lasers are welded in ...
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