Search
CSV
RISStress Analyses of Flip TAB Interconnects in Multi-Chip Module Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip Tape Automated Bond (FTAB) interconnect is one of the leading candidates for device to substrate interconnection in a high performance Multi-Chip Module (MCM). The TAB interconnect becomes ...
A Shape Optimal Design Methodology for Packaging Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Shape optimal design methodology has been used as a design tool in the automotive and aerospace industries for quite some time now. In the present work the hybrid natural shape optimal design ...