Abstract: An analytical model is derived for the calculation of thermo-mechanical induced stresses in area array flip chip assemblies. This analytical model is based on structural mechanics and has the ...

Abstract: Electronic packages are multimaterial structures. Their reliability is a major concern for the electronic industry and therefore widely studied. Apart from the electrical performance, the mechanical ...

Abstract: Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board ...