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    A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002:;page 20906
    Author(s): Satish Kumar; Baratunde A. Cola; Roderick Jackson; Samuel Graham
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The exceptional electronic, thermal, mechanical, and optical characteristics of carbon nanotubes offer significant improvement in diverse applications such as flexible electronics, energy conversion, ...
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    Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002:;page 20907
    Author(s): Stephen L. Hodson; Thiruvelu Bhuvana; Baratunde A. Cola; Xianfan Xu; G. U. Kulkarni; Timothy S. Fisher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which ...
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    Effects of Growth Temperature on Carbon Nanotube Array Thermal Interfaces 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 011:;page 114503
    Author(s): Baratunde A. Cola; Placidus B. Amama; Xianfan Xu; Timothy S. Fisher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to their excellent compliance and high thermal conductivity, dry carbon nanotube (CNT) array interfaces are promising candidates to address the thermal management needs of power dense ...
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    Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 002:;page 20901
    Author(s): Joseph R. Wasniewski; Stephen L. Hodson; Anuradha Bulusu; Samuel Graham; Timothy S. Fisher; David H. Altman; Baratunde A. Cola
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured ...
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