Abstract: A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow ...

Abstract: Much progress has been made in the simulation and verification of the thermo-mechanical behavior of plastic packages. On the other hand, until now there is a lack in the consideration of the ...

Abstract: The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and ...

Abstract: Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approaches. The necessary understanding of the impact of very local material stressing on component ...

Abstract: The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive ...

Abstract: We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed ...

Abstract: Nanofluids have been proposed to improve the performance of microchannel heat sinks. In this paper, we present a systematic characterization of aqueous silica nanoparticle suspensions with ...