Abstract: The results of a study of a new and unique high-performance air-cooled impingement heat sink are presented. An extensive numerical investigation of the heat sink performance is conducted and ...

Abstract: In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board ...

Abstract: Three-dimensional (3D) packages are of considerable interest at the present time as a means for heterogeneous high-performance integration of disparate digital, analog, optical, and MEMS technologies. ...