Abstract: Automating quality control has been an ongoing effort, especially when manufacturing large flip-chips. One such method is through employing the convolutional neural network (CNN). This work studied the optimum setup of the ...

Abstract: Underfilling in flip chip packages is a critical component of reliability. This study utilized I-type, L-type, and U-type dispensing methods to address the issue, namely, voiding that creates empty spaces, which compromises ...