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    Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004:;page 310
    Author(s): Ann M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In many heat transfer situations, such as those found in the electronics cooling field, more than a single mode of heat transfer occurs. For example, modules on a printed circuit board dissipate ...
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    The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001:;page 14
    Author(s): Ann M. Anderson; Robert J. Moffat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper describes an investigation of the forced convection heat transfer and pressure drop characteristics of a regular in-line array of flatpacks for several channel heights and inlet ...
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    A Light Transmission Based Liquid Crystal Thermography System 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 001:;page 14503
    Author(s): Timothy B. Roth; Ann M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents results from a study aimed at developing a novel thermochromic liquid crystal (TLC) temperature measurement system that uses light transmission instead of light reflection to ...
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