Abstract: Thermo-mechanical failure of components in planar-type solid oxide fuel cells (SOFCs) depends strongly on the local temperature gradients at the interfaces of different materials. Therefore, it ...

Abstract: Microprocessor performance can be significantly improved by lowering the junction temperature, especially down to the deep subambient levels. This provides the strong motivation for the current ...

Abstract: An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes ...

Abstract: The ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption ...

Abstract: It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). ...

Abstract: The recent application of inkjet printing to fabrication of three-dimensional, multilayer and multimaterial parts has tested the limits of conventional printing-based additive manufacturing techniques. ...