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    On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 235
    Author(s): Alfonso Ortega; Shankar Ramanathan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A model for uniform parallel flow over the surface of a rectangular source of heat on a conducting plate is used to demonstrate the use of analytic Green’s functions to formulate the conjugate ...
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    On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 226
    Author(s): Alfonso Ortega; Shankar Ramanathan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Analytical solutions are presented for the temperature field that arises from the application of a source of heat on an adiabatic plate or board when the fluid is represented as a uniform ...
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    Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001:;page 61
    Author(s): Johnny S. Issa; Alfonso Ortega
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The flow behavior and heat transfer due to free air jet impingement on pin fin heat sinks was experimentally studied. Flow velocities and tip clearance ratios were varied from 2to20m∕s and 0 ...
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    Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003:;page 342
    Author(s): Duckjong Kim; Sung Jin Kim; Alfonso Ortega
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this work, a novel compact modeling method based on the volume-averaging technique is presented. Its application to the analysis of fluid flow and heat transfer in pin fin heat sinks are ...
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    A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001:;page 53
    Author(s): M. Baris Dogruoz; Russell V. Westphal; Alfonso Ortega
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A model for the pressure drop and heat transfer behavior of heat sinks with top bypass is presented. In addition to the characteristics of a traditional two-branch bypass model, the physics ...
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