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RISThermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN on SiC Semiconductor Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...
Special Section on InterPACK2021
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It ...
An Experimental Investigation of Sintered Particle Effect on Heat Transfer Performance in an “Annular Flow” Evaporation Tube
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wicking structures have been widely used within passive heat transfer devices with high heat fluxes, such as heat pipes, to enhance their thermal performance. While wicking structures promote capillary pumping of the working ...