Abstract: The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, ...

Abstract: Underfilling in flip chip packages is a critical component of reliability. This study utilized I-type, L-type, and U-type dispensing methods to address the issue, namely, voiding that creates empty spaces, which compromises ...

Abstract: Automating quality control has been an ongoing effort, especially when manufacturing large flip-chips. One such method is through employing the convolutional neural network (CNN). This work studied the optimum setup of the ...

Abstract: The conventional capillary underfill process has been a common practice in the industry, somehow the process is costly and time-consuming. Thus, no-flow underfill process is developed to increase the effective lead time ...