Abstract: Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not necessarily fit experimental data. The phenomenon can be correlated with a ...

Abstract: This paper focuses on mechanical testing designed to determine the static failure envelope for a conductive adhesive. Samples were made by bonding copper pegs together with the conductive adhesive. ...

Abstract: An elasto-viscoplastic constitutive equation is derived for a lead-tin alloy used in the microelectronics industry. This crystalline material exhibits nonlinear characteristics, such as strain hardening and saturation ...

Abstract: Fatigue lifetimes of low-tin high-lead and tin-lead eutectic solders under total strain controlled tension-tension tests were studied in this paper. Based on the stress and strain micro-macro ...