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RISStress Analysis and Thermal Characterization of a High Pin Count PQFP
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional finite element model of a high pin count plastic-quad-flat-pack (PQFP) has been developed by using ANSYS™ finite element simulation code [1]. The model has been used for ...
Optimization of Extruded Type External Heat Sink for Multichip Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional finite element model of a multichip module (MCM) has been developed by using ANSYS™ finite element simulation code. The model has been used for thermal characterization of ...
The Transient, Steady-State, and Stability Behavior of a Toroidal Thermosyphon With a Parallel-Flow Heat Exchanger
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The transient and steady-state heat transfer, fluid flow, and stability of a toroidal thermosyphon have been studied theoretically. The thermosyphon is heated over the lower half and cooled over ...