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    Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002:;page 112
    Author(s): Z. Guo; A. F. Sprecher; H. Conrad
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The deformation kinetics of near-eutectic Pb-Sn alloys in monotonic and cyclic loading in shear at 300K were investigated by determining the stress exponent n in the Dorn equation using several ...
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    Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002:;page 153
    Author(s): P. Hacke; A. F. Sprecher; H. Conrad
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermo-mechanical cycling (– 30°/130°C) tests were performed on 63Sn37Pb solder joints with cycle periods of 12–48 min. The effect of phase (grain) size was incorporated into the ...
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