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    Si Thin Film With Nanohole Structures to Improve Thermoelectric Performance Part 2: Inverse Fishbone Holes

    Source: ASME Journal of Heat and Mass Transfer:;2026:;volume( 148 ):;issue:002::page 1235
    Author:
    Kajinami, Nobuhiko
    ,
    Sato, Moeka
    ,
    Takahara, Yoshiya
    ,
    Hanaoka, Misaki
    ,
    Iwakawa, Manabu
    ,
    Matsumoto, Mitsuhiro
    DOI: 10.1115/1.4070083
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. In recent years, the demand for high-performance thermoelectric materials for device applications has grown significantly. Controlling thermal transport is important for improving performance. A common approach involves using nanoscale structural interfaces to scatter phonons. This method exploits the differences in mean free paths (MFPs) between phonons and electric charge carriers. By introducing nanostructures, propagation of phonons with long MFPs can be selectively suppressed, reducing thermal conductivity without significantly impacting electrical conductivity. Through simulations based on the Boltzmann transport equation (BTE), we have investigated nanoscale structures that enhance thermoelectric performance. In a previous paper, we analyzed the effects of periodically arranged hole shapes and found that an H-shaped structure with notches oriented perpendicularly to the heat flow achieves the highest thermoelectric performance. We referred to such hole shapes as the “Y-direction phonon trap.” In this study, based on the results of our previous research, we developed a new hole design referred to as the “inverse fishbone.” By optimizing the structural parameters of the Y-direction phonon trap in the inverse fishbone structure, we achieved a dimensionless figure of merit more than four times that of pristine thin films.
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      Si Thin Film With Nanohole Structures to Improve Thermoelectric Performance Part 2: Inverse Fishbone Holes

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    https://yetl.yabesh.ir/yetl1/handle/yetl/4316268
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    contributor authorKajinami, Nobuhiko
    contributor authorSato, Moeka
    contributor authorTakahara, Yoshiya
    contributor authorHanaoka, Misaki
    contributor authorIwakawa, Manabu
    contributor authorMatsumoto, Mitsuhiro
    date accessioned2026-08-23T08:14:37Z
    date available2026-08-23T08:14:37Z
    date copyright2026/02/01
    date issued2026
    identifier issn2832-8450
    identifier otherht-25-1049.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4316268
    description abstractAbstract. In recent years, the demand for high-performance thermoelectric materials for device applications has grown significantly. Controlling thermal transport is important for improving performance. A common approach involves using nanoscale structural interfaces to scatter phonons. This method exploits the differences in mean free paths (MFPs) between phonons and electric charge carriers. By introducing nanostructures, propagation of phonons with long MFPs can be selectively suppressed, reducing thermal conductivity without significantly impacting electrical conductivity. Through simulations based on the Boltzmann transport equation (BTE), we have investigated nanoscale structures that enhance thermoelectric performance. In a previous paper, we analyzed the effects of periodically arranged hole shapes and found that an H-shaped structure with notches oriented perpendicularly to the heat flow achieves the highest thermoelectric performance. We referred to such hole shapes as the “Y-direction phonon trap.” In this study, based on the results of our previous research, we developed a new hole design referred to as the “inverse fishbone.” By optimizing the structural parameters of the Y-direction phonon trap in the inverse fishbone structure, we achieved a dimensionless figure of merit more than four times that of pristine thin films.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSi Thin Film With Nanohole Structures to Improve Thermoelectric Performance Part 2: Inverse Fishbone Holes
    typeJournal Paper
    journal volume148
    journal issue2
    journal titleASME Journal of Heat and Mass Transfer
    identifier doi10.1115/1.4070083
    journal fristpage1235
    journal lastpage1249
    page15
    treeASME Journal of Heat and Mass Transfer:;2026:;volume( 148 ):;issue:002
    contenttypeFulltext
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