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    Detailed Convective Heat Transfer at the Endwalls of Pin Fin, Body-Centered Cubic, Tetrakaidecahedron, and Octet Lattice-Based Cooling Channels

    Source: Journal of Thermal Science and Engineering Applications:;2026:;volume( 018 ):;issue:007
    Author:
    Aider, Youssef
    ,
    Singh, Prashant
    DOI: 10.1115/1.4071500
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. This study presents detailed endwall convective heat transfer measurements for four lattice topologies—pin fins, body-centered cubic (BCC), tetrakaidecahedron (TKD), and octet—arranged in inline configurations within a square duct. Each topology was tested in two configurations: continuous and discretely placed unit cells along the flow direction, resulting in a total of eight test articles. The transient liquid crystal thermography technique has been employed to determine the local convection heat transfer coefficient resulting from the sole contribution of fluid dynamics in lattice-based channels. The test articles were additively manufactured in a low thermal conductivity and low thermal diffusivity resin and installed in a duct (aspect ratio 1:1) representative of the mid-chord region of high-pressure turbine blades. Experiments were conducted for Reynolds numbers between 10,000 and 30,000. Heat transfer results are presented as normalized Nusselt number maps and spanwise-averaged profiles, revealing periodicity in the unit cell's thermal performance. TKD and octet topologies exhibited the highest convective heat transfer, while BCC demonstrated superior thermal-hydraulic performance. These results offer valuable benchmarks for computational studies using periodic boundary conditions in fluid-only domains.
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      Detailed Convective Heat Transfer at the Endwalls of Pin Fin, Body-Centered Cubic, Tetrakaidecahedron, and Octet Lattice-Based Cooling Channels

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    https://yetl.yabesh.ir/yetl1/handle/yetl/4315367
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    contributor authorAider, Youssef
    contributor authorSingh, Prashant
    date accessioned2026-08-23T07:37:31Z
    date available2026-08-23T07:37:31Z
    date copyright2026/07/01
    date issued2026
    identifier issn1948-5085
    identifier othertsea-25-1703.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4315367
    description abstractAbstract. This study presents detailed endwall convective heat transfer measurements for four lattice topologies—pin fins, body-centered cubic (BCC), tetrakaidecahedron (TKD), and octet—arranged in inline configurations within a square duct. Each topology was tested in two configurations: continuous and discretely placed unit cells along the flow direction, resulting in a total of eight test articles. The transient liquid crystal thermography technique has been employed to determine the local convection heat transfer coefficient resulting from the sole contribution of fluid dynamics in lattice-based channels. The test articles were additively manufactured in a low thermal conductivity and low thermal diffusivity resin and installed in a duct (aspect ratio 1:1) representative of the mid-chord region of high-pressure turbine blades. Experiments were conducted for Reynolds numbers between 10,000 and 30,000. Heat transfer results are presented as normalized Nusselt number maps and spanwise-averaged profiles, revealing periodicity in the unit cell's thermal performance. TKD and octet topologies exhibited the highest convective heat transfer, while BCC demonstrated superior thermal-hydraulic performance. These results offer valuable benchmarks for computational studies using periodic boundary conditions in fluid-only domains.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDetailed Convective Heat Transfer at the Endwalls of Pin Fin, Body-Centered Cubic, Tetrakaidecahedron, and Octet Lattice-Based Cooling Channels
    typeJournal Paper
    journal volume18
    journal issue7
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4071500
    treeJournal of Thermal Science and Engineering Applications:;2026:;volume( 018 ):;issue:007
    contenttypeFulltext
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