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    Compliant Mechanisms for Invertible Poisson’s Ratio and Tunable Stiffness in Cell Culture Substrates

    Source: Journal of Mechanical Design:;2026:;volume( 148 ):;issue:010::page 677
    Author:
    Sebastian, Manu
    ,
    Balakrishnan, Sreenath
    ,
    Palathingal, Safvan
    DOI: 10.1115/1.4071439
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. The mechanical environment of a substrate plays a key role in influencing the behavior of adherent biological cells, with implications for designing substrates suited for organoid culture. Traditional tunable substrates have limitations as their mechanical properties cannot be independently altered in situ during cell culture. We present an alternate approach by using compliant mechanisms that enable realization of tunable substrate properties, specifically, invertible Poisson’s ratio and tunable stiffness. These mechanisms transition between positive and negative Poisson’s effects with tunable magnitude through a bistable engaging–disengaging compliant mechanism (EDCM). EDCM allows stiffness between two points of the substrate to switch between zero and theoretically infinite. In the stiffened state, lateral deformation reverses under a constant axial load, while when stiffness is zero, the deformation direction remains outward as that of re-entrant structure. EDCM in conjunction with an offset mechanism also allows tuning of the effective stiffness of the entire mechanism. We present analytical models correlating geometric parameters to displacement ratios in both bistable states and through illustrative design cases, and demonstrate their potential for designing dynamic and reconfigurable cell culture substrates.
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      Compliant Mechanisms for Invertible Poisson’s Ratio and Tunable Stiffness in Cell Culture Substrates

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    https://yetl.yabesh.ir/yetl1/handle/yetl/4315194
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    contributor authorSebastian, Manu
    contributor authorBalakrishnan, Sreenath
    contributor authorPalathingal, Safvan
    date accessioned2026-08-23T07:30:27Z
    date available2026-08-23T07:30:27Z
    date copyright2026/10/01
    date issued2026
    identifier issn1050-0472
    identifier othermd-25-1550.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4315194
    description abstractAbstract. The mechanical environment of a substrate plays a key role in influencing the behavior of adherent biological cells, with implications for designing substrates suited for organoid culture. Traditional tunable substrates have limitations as their mechanical properties cannot be independently altered in situ during cell culture. We present an alternate approach by using compliant mechanisms that enable realization of tunable substrate properties, specifically, invertible Poisson’s ratio and tunable stiffness. These mechanisms transition between positive and negative Poisson’s effects with tunable magnitude through a bistable engaging–disengaging compliant mechanism (EDCM). EDCM allows stiffness between two points of the substrate to switch between zero and theoretically infinite. In the stiffened state, lateral deformation reverses under a constant axial load, while when stiffness is zero, the deformation direction remains outward as that of re-entrant structure. EDCM in conjunction with an offset mechanism also allows tuning of the effective stiffness of the entire mechanism. We present analytical models correlating geometric parameters to displacement ratios in both bistable states and through illustrative design cases, and demonstrate their potential for designing dynamic and reconfigurable cell culture substrates.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCompliant Mechanisms for Invertible Poisson’s Ratio and Tunable Stiffness in Cell Culture Substrates
    typeJournal Paper
    journal volume148
    journal issue10
    journal titleJournal of Mechanical Design
    identifier doi10.1115/1.4071439
    journal fristpage677
    journal lastpage89
    page-587
    treeJournal of Mechanical Design:;2026:;volume( 148 ):;issue:010
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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