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    Analytical Model of Organic Contaminant Dynamics in Landfill Liners Subjected to Thermal Gradients

    Source: Journal of Environmental Engineering:;2026:;Volume ( 152 ):;issue: 004::page 04026006-1
    Author:
    Zhang, Chunhua
    ,
    Hu, Jiangtao
    ,
    Ding, Hao
    ,
    Zeng, Wei
    ,
    Guo, Zhongqun
    ,
    Deng, Tongfa
    DOI: 10.1061/JOEEDU.EEENG-8175
    Publisher: American Society of Civil Engineers
    Abstract: AbstractPredicting contaminant transport through landfill liners is crucial for evaluating groundwater pollution risks. This study proposes an analytical model of organic contaminants transport through various landfill liner systems considering the ...
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      Analytical Model of Organic Contaminant Dynamics in Landfill Liners Subjected to Thermal Gradients

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/4312819
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    • Journal of Environmental Engineering

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    contributor authorZhang, Chunhua
    contributor authorHu, Jiangtao
    contributor authorDing, Hao
    contributor authorZeng, Wei
    contributor authorGuo, Zhongqun
    contributor authorDeng, Tongfa
    date accessioned2026-08-20T11:54:03Z
    date available2026-08-20T11:54:03Z
    date copyright2026/01/30
    date issued2026
    identifier otherJOEEDU.EEENG-8175.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4312819
    description abstractAbstractPredicting contaminant transport through landfill liners is crucial for evaluating groundwater pollution risks. This study proposes an analytical model of organic contaminants transport through various landfill liner systems considering the ...
    publisherAmerican Society of Civil Engineers
    titleAnalytical Model of Organic Contaminant Dynamics in Landfill Liners Subjected to Thermal Gradients
    typeJournal Article
    journal volume152
    journal issue4
    journal titleJournal of Environmental Engineering
    identifier doi10.1061/JOEEDU.EEENG-8175
    journal fristpage04026006-1
    journal lastpage04026006-16
    page16
    treeJournal of Environmental Engineering:;2026:;Volume ( 152 ):;issue: 004
    contenttypeFulltext
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