Show simple item record

contributor authorLuloff, Mark S.
contributor authorContant, Stephane
contributor authorMorelli, Jordan
contributor authorKrause, Thomas W.
date accessioned2022-02-04T22:15:41Z
date available2022-02-04T22:15:41Z
date copyright6/26/2020 12:00:00 AM
date issued2020
identifier issn2572-3901
identifier othernde_3_4_041104.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4275209
description abstractA validated analytical model of a transmit–receive coil pair situated above two parallel plates, separated by an air gap, was used as the basis for an inversion algorithm (IA) to extract probe liftoff, second layer plate resistivity, and plate-to-plate gap from multi-frequency eddy current data. The IA was tested over a large range of first layer wall thickness (3.80–4.64 mm), second layer plate resistivity (1.7–174 µΩ cm), second layer wall thickness (1.20–4.85 mm), probe liftoff (2.8–7.9 mm), and plate-to-plate gap (0–13.3 mm). At nominal liftoff (2.8 mm), the IA achieved a gap measurement accuracy of ±0.7 mm and was able to return good estimates of the second layer resistivity within ±1 μΩ cm for low resistivity samples, but with decreasing accuracy for higher resistivities. When the gap was fixed, the IA was able to measure changes in probe liftoff (relative to nominal) to an accuracy of ±0.2 mm. The reported accuracy and a demonstration for the ability to accurately estimate parameters outside of the calibration range provide confidence in the potential utility of the algorithm.
publisherThe American Society of Mechanical Engineers (ASME)
titleSimultaneous Extraction of Multiple Parameters From a Transmit–Receive Eddy Current Probe Above a Layered Planar Conductive Structure
typeJournal Paper
journal volume3
journal issue4
journal titleJournal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
identifier doi10.1115/1.4047293
journal fristpage041104-1
journal lastpage041104-5
page5
treeJournal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems:;2020:;volume( 003 ):;issue: 004
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record