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    Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001::page 10902
    Author:
    Athavale, Jayati
    ,
    Joshi, Yogendra
    ,
    Yoda, Minami
    DOI: 10.1115/1.4039025
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents an experimentally validated room-level computational fluid dynamics (CFD) model for raised-floor data center configurations employing active tiles. Active tiles are perforated floor tiles with integrated fans, which increase the local volume flow rate by redistributing the cold air supplied by the computer room air conditioning (CRAC) unit to the under-floor plenum. The numerical model of the data center room consists of one cold aisle with 12 racks arranged on both sides and three CRAC units sited around the periphery of the room. The commercial CFD software package futurefacilities6sigmadcx is used to develop the model for three configurations: (a) an aisle populated with ten (i.e., all) passive tiles; (b) a single active tile and nine passive tiles in the cold aisle; and (c) an aisle populated with all active tiles. The predictions from the CFD model are found to be in good agreement with the experimental data, with an average discrepancy between the measured and computed values for total flow rate and rack inlet temperature less than 4% and 1.7 °C, respectively. The validated models were then used to simulate steady-state and transient scenarios following cooling failure. This physics-based and experimentally validated room-level model can be used for temperature and flow distributions prediction and identifying optimal number and locations of active tiles for hot spot mitigation in data centers.
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      Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

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    https://yetl.yabesh.ir/yetl1/handle/yetl/4254139
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    contributor authorAthavale, Jayati
    contributor authorJoshi, Yogendra
    contributor authorYoda, Minami
    date accessioned2019-02-28T11:14:08Z
    date available2019-02-28T11:14:08Z
    date copyright3/2/2018 12:00:00 AM
    date issued2018
    identifier issn1043-7398
    identifier otherep_140_01_010902.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254139
    description abstractThis paper presents an experimentally validated room-level computational fluid dynamics (CFD) model for raised-floor data center configurations employing active tiles. Active tiles are perforated floor tiles with integrated fans, which increase the local volume flow rate by redistributing the cold air supplied by the computer room air conditioning (CRAC) unit to the under-floor plenum. The numerical model of the data center room consists of one cold aisle with 12 racks arranged on both sides and three CRAC units sited around the periphery of the room. The commercial CFD software package futurefacilities6sigmadcx is used to develop the model for three configurations: (a) an aisle populated with ten (i.e., all) passive tiles; (b) a single active tile and nine passive tiles in the cold aisle; and (c) an aisle populated with all active tiles. The predictions from the CFD model are found to be in good agreement with the experimental data, with an average discrepancy between the measured and computed values for total flow rate and rack inlet temperature less than 4% and 1.7 °C, respectively. The validated models were then used to simulate steady-state and transient scenarios following cooling failure. This physics-based and experimentally validated room-level model can be used for temperature and flow distributions prediction and identifying optimal number and locations of active tiles for hot spot mitigation in data centers.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleExperimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
    typeJournal Paper
    journal volume140
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4039025
    journal fristpage10902
    journal lastpage010902-10
    treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian