| contributor author | Dong, Hua | |
| contributor author | Chen, Ranran | |
| contributor author | Mu, Yongqiang | |
| contributor author | Liu, Shouting | |
| contributor author | Zhang, Jingkui | |
| contributor author | Lin, Huan | |
| date accessioned | 2019-02-28T11:07:44Z | |
| date available | 2019-02-28T11:07:44Z | |
| date copyright | 7/25/2017 12:00:00 AM | |
| date issued | 2018 | |
| identifier issn | 1948-5085 | |
| identifier other | tsea_010_01_011012.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4252983 | |
| description abstract | The thermal transport in metallic thin films can be reduced by the electron scattering and there are very little available knowledge that can be used to explain the mechanism. In this work, we characterized the thermal and electron transport of 3.2 nm thin gold films coated on alginate fiber by the transient electrothermal (TET) technique. The results reveal that the thermal and electrical conductivities are reduced significantly from the respective values of bulk material by 76.2% and 93.9%. At the same time, the Lorenz number is calculated as 8.66 × 10−8 W Ω K−2 and it is almost three times increased from the value of bulk material. The intrinsic thermal diffusivity of alginate fiber is 3.25 × 10−7 m2 s−1 and the thermal conductivity is 0.51 W m−1 K−1. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal and Electrical Properties of 3.2 nm Thin Gold Films Coated on Alginate Fiber | |
| type | Journal Paper | |
| journal volume | 10 | |
| journal issue | 1 | |
| journal title | Journal of Thermal Science and Engineering Applications | |
| identifier doi | 10.1115/1.4036798 | |
| journal fristpage | 11012 | |
| journal lastpage | 011012-5 | |
| tree | Journal of Thermal Science and Engineering Applications:;2018:;volume( 010 ):;issue: 001 | |
| contenttype | Fulltext | |