| contributor author | J. T. Pogson | |
| contributor author | J. L. Franklin | |
| date accessioned | 2017-05-09T01:36:43Z | |
| date available | 2017-05-09T01:36:43Z | |
| date copyright | November, 1973 | |
| date issued | 1973 | |
| identifier issn | 1087-1357 | |
| identifier other | JMSEFK-27598#1048_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/163980 | |
| description abstract | The results of a study on thermal modeling and analysis of hybrid microcircuits are presented. Parametric studies covering typical component mounting methods, bonding agent materials, and component spacing are described. Temperature profiles of substrates, component temperatures, and thermal resistances are presented. It is shown that the use of moly tabs can significantly reduce component temperature levels. Additionally, it is shown that thermal modeling can greatly aid the circuit designer in the layout and preliminary design phases. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Analysis and Temperature Control of Hybrid Microcircuits | |
| type | Journal Paper | |
| journal volume | 95 | |
| journal issue | 4 | |
| journal title | Journal of Manufacturing Science and Engineering | |
| identifier doi | 10.1115/1.3438250 | |
| journal fristpage | 1048 | |
| journal lastpage | 1052 | |
| identifier eissn | 1528-8935 | |
| keywords | Temperature | |
| keywords | Temperature control | |
| keywords | Bonding agents | |
| keywords | Design | |
| keywords | Modeling | |
| keywords | Circuits AND Temperature profiles | |
| tree | Journal of Manufacturing Science and Engineering:;1973:;volume( 095 ):;issue: 004 | |
| contenttype | Fulltext | |