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    Phonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport Equation

    Source: Journal of Heat Transfer:;2015:;volume( 137 ):;issue: 010::page 102401
    Author:
    Ali, Syed Ashraf
    ,
    Mazumder, Sandip
    DOI: 10.1115/1.4030565
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this article, two models for phonon transmission across semiconductor interfaces are investigated and demonstrated in the context of largescale spatially threedimensional calculations of the phonon Boltzmann transport equation (BTE). These include two modified forms of the classical diffuse mismatch model (DMM): one, in which dispersion is accounted for and another, in which energy transfer between longitudinal acoustic (LA) and transverse acoustic (TA) phonons is disallowed. As opposed to the vast majority of the previous studies in which the interface is treated in isolation, and the thermal boundary conductance is calculated using closedform analytical formulations, the present study also considers the interplay between the interface and intrinsic (volumetric) scattering of phonons. This is accomplished by incorporating the interface models into a parallel solver for the full sevendimensional BTE for phonons. A verification study is conducted in which the thermal boundary resistance of a silicon/germanium interface is compared against the previously reported results of molecular dynamics (MD) calculations. The BTE solutions overpredicted the interfacial resistance, and the reasons for this discrepancy are discussed. It is found that due to the interplay between intrinsic and interface scattering, the interfacial thermal resistance across a Si(hot)/Ge(cold) bilayer is different from that of a Si(cold)/Ge(hot) bilayer. Finally, the phonon BTE is solved for a nanoscale threedimensional heterostructure, comprised of multiple blocks of silicon and germanium, and the time evolution of the temperature distribution is predicted and compared against predictions using the Fourier law of heat conduction.
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      Phonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport Equation

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    https://yetl.yabesh.ir/yetl1/handle/yetl/158573
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    contributor authorAli, Syed Ashraf
    contributor authorMazumder, Sandip
    date accessioned2017-05-09T01:19:58Z
    date available2017-05-09T01:19:58Z
    date issued2015
    identifier issn0022-1481
    identifier otherht_137_10_102401.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/158573
    description abstractIn this article, two models for phonon transmission across semiconductor interfaces are investigated and demonstrated in the context of largescale spatially threedimensional calculations of the phonon Boltzmann transport equation (BTE). These include two modified forms of the classical diffuse mismatch model (DMM): one, in which dispersion is accounted for and another, in which energy transfer between longitudinal acoustic (LA) and transverse acoustic (TA) phonons is disallowed. As opposed to the vast majority of the previous studies in which the interface is treated in isolation, and the thermal boundary conductance is calculated using closedform analytical formulations, the present study also considers the interplay between the interface and intrinsic (volumetric) scattering of phonons. This is accomplished by incorporating the interface models into a parallel solver for the full sevendimensional BTE for phonons. A verification study is conducted in which the thermal boundary resistance of a silicon/germanium interface is compared against the previously reported results of molecular dynamics (MD) calculations. The BTE solutions overpredicted the interfacial resistance, and the reasons for this discrepancy are discussed. It is found that due to the interplay between intrinsic and interface scattering, the interfacial thermal resistance across a Si(hot)/Ge(cold) bilayer is different from that of a Si(cold)/Ge(hot) bilayer. Finally, the phonon BTE is solved for a nanoscale threedimensional heterostructure, comprised of multiple blocks of silicon and germanium, and the time evolution of the temperature distribution is predicted and compared against predictions using the Fourier law of heat conduction.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePhonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport Equation
    typeJournal Paper
    journal volume137
    journal issue10
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4030565
    journal fristpage102401
    journal lastpage102401
    identifier eissn1528-8943
    treeJournal of Heat Transfer:;2015:;volume( 137 ):;issue: 010
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian