Phonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport EquationSource: Journal of Heat Transfer:;2015:;volume( 137 ):;issue: 010::page 102401DOI: 10.1115/1.4030565Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this article, two models for phonon transmission across semiconductor interfaces are investigated and demonstrated in the context of largescale spatially threedimensional calculations of the phonon Boltzmann transport equation (BTE). These include two modified forms of the classical diffuse mismatch model (DMM): one, in which dispersion is accounted for and another, in which energy transfer between longitudinal acoustic (LA) and transverse acoustic (TA) phonons is disallowed. As opposed to the vast majority of the previous studies in which the interface is treated in isolation, and the thermal boundary conductance is calculated using closedform analytical formulations, the present study also considers the interplay between the interface and intrinsic (volumetric) scattering of phonons. This is accomplished by incorporating the interface models into a parallel solver for the full sevendimensional BTE for phonons. A verification study is conducted in which the thermal boundary resistance of a silicon/germanium interface is compared against the previously reported results of molecular dynamics (MD) calculations. The BTE solutions overpredicted the interfacial resistance, and the reasons for this discrepancy are discussed. It is found that due to the interplay between intrinsic and interface scattering, the interfacial thermal resistance across a Si(hot)/Ge(cold) bilayer is different from that of a Si(cold)/Ge(hot) bilayer. Finally, the phonon BTE is solved for a nanoscale threedimensional heterostructure, comprised of multiple blocks of silicon and germanium, and the time evolution of the temperature distribution is predicted and compared against predictions using the Fourier law of heat conduction.
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| contributor author | Ali, Syed Ashraf | |
| contributor author | Mazumder, Sandip | |
| date accessioned | 2017-05-09T01:19:58Z | |
| date available | 2017-05-09T01:19:58Z | |
| date issued | 2015 | |
| identifier issn | 0022-1481 | |
| identifier other | ht_137_10_102401.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/158573 | |
| description abstract | In this article, two models for phonon transmission across semiconductor interfaces are investigated and demonstrated in the context of largescale spatially threedimensional calculations of the phonon Boltzmann transport equation (BTE). These include two modified forms of the classical diffuse mismatch model (DMM): one, in which dispersion is accounted for and another, in which energy transfer between longitudinal acoustic (LA) and transverse acoustic (TA) phonons is disallowed. As opposed to the vast majority of the previous studies in which the interface is treated in isolation, and the thermal boundary conductance is calculated using closedform analytical formulations, the present study also considers the interplay between the interface and intrinsic (volumetric) scattering of phonons. This is accomplished by incorporating the interface models into a parallel solver for the full sevendimensional BTE for phonons. A verification study is conducted in which the thermal boundary resistance of a silicon/germanium interface is compared against the previously reported results of molecular dynamics (MD) calculations. The BTE solutions overpredicted the interfacial resistance, and the reasons for this discrepancy are discussed. It is found that due to the interplay between intrinsic and interface scattering, the interfacial thermal resistance across a Si(hot)/Ge(cold) bilayer is different from that of a Si(cold)/Ge(hot) bilayer. Finally, the phonon BTE is solved for a nanoscale threedimensional heterostructure, comprised of multiple blocks of silicon and germanium, and the time evolution of the temperature distribution is predicted and compared against predictions using the Fourier law of heat conduction. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Phonon Heat Conduction in Multidimensional Heterostructures: Predictions Using the Boltzmann Transport Equation | |
| type | Journal Paper | |
| journal volume | 137 | |
| journal issue | 10 | |
| journal title | Journal of Heat Transfer | |
| identifier doi | 10.1115/1.4030565 | |
| journal fristpage | 102401 | |
| journal lastpage | 102401 | |
| identifier eissn | 1528-8943 | |
| tree | Journal of Heat Transfer:;2015:;volume( 137 ):;issue: 010 | |
| contenttype | Fulltext |