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    PCB Origami: A Material Based Design Approach to Computer Aided Foldable Electronic Devices

    Source: Journal of Mechanical Design:;2013:;volume( 135 ):;issue: 011::page 114502
    Author:
    Sterman, Yoav
    ,
    Demaine, Erik D.
    ,
    Oxman, Neri
    DOI: 10.1115/1.4025370
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Origami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays, it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as light emitting diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process.
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      PCB Origami: A Material Based Design Approach to Computer Aided Foldable Electronic Devices

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    https://yetl.yabesh.ir/yetl1/handle/yetl/152595
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    contributor authorSterman, Yoav
    contributor authorDemaine, Erik D.
    contributor authorOxman, Neri
    date accessioned2017-05-09T01:01:09Z
    date available2017-05-09T01:01:09Z
    date issued2013
    identifier issn1050-0472
    identifier othermd_135_11_114502.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/152595
    description abstractOrigami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays, it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as light emitting diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePCB Origami: A Material Based Design Approach to Computer Aided Foldable Electronic Devices
    typeJournal Paper
    journal volume135
    journal issue11
    journal titleJournal of Mechanical Design
    identifier doi10.1115/1.4025370
    journal fristpage114502
    journal lastpage114502
    identifier eissn1528-9001
    treeJournal of Mechanical Design:;2013:;volume( 135 ):;issue: 011
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian