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    An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003::page 31003
    Author:
    Dan, B.
    ,
    Sammakia, B. G.
    ,
    Subbarayan, G.
    ,
    Kanuparthi, S.
    DOI: 10.1115/1.4024392
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal interface materials (TIMs) are particulate composite materials widely used in the microelectronics industry to reduce the thermal resistance between the device and heat sink. Predictive modeling using fundamental physical principles is critical to developing new TIMs since it can be used to quantify the effect of particle volume fraction and arrangements on the effective thermal conductivity. The existing analytical descriptions of thermal transport in particulate systems do not accurately account for the effect of interparticle interactions, especially in the intermediate volume fractions of 30–80%. An efficient random network model (RNM) that captures the nearpercolation transport in these particlefilled systems, taking into account the interparticle interactions and random size distributions, was previously developed by Kanuparthi et al. The RNM approach uses a cylindrical region to approximate the thermal transport within the filler particles and to capture the interparticle interactions. However, this approximation is less accurate when the polydispersivity of the particulate system increases. In addition, the accuracy of the RNM is dependent on the parameters inherent in an analytical description of thermal transport between two spherical particles and their numerical approximation into the network model. In the current paper, a novel semispherical approximation to the conductance of the fillers is presented as an alternative to the cylindrical region approximation used earlier. Compared with the cylindrical model, the thermal conductivities of the semispherical model are more closely to the finite element (FE) results. Based on the FE analysis, the network model is improved by developing an approximation of the critical cylindrical region between two spherical particles over which energy is transported. Comparing the RNM results with FE results and experimental data, a linear relationship of the critical parameter with the thermal conductivity ratio and the volume fraction was found that provides a more accurate prediction of the effective thermal conductivity of the particulate TIMs.
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      An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

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    https://yetl.yabesh.ir/yetl1/handle/yetl/151433
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    contributor authorDan, B.
    contributor authorSammakia, B. G.
    contributor authorSubbarayan, G.
    contributor authorKanuparthi, S.
    date accessioned2017-05-09T00:57:43Z
    date available2017-05-09T00:57:43Z
    date issued2013
    identifier issn1528-9044
    identifier otherep_135_03_031003.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151433
    description abstractThermal interface materials (TIMs) are particulate composite materials widely used in the microelectronics industry to reduce the thermal resistance between the device and heat sink. Predictive modeling using fundamental physical principles is critical to developing new TIMs since it can be used to quantify the effect of particle volume fraction and arrangements on the effective thermal conductivity. The existing analytical descriptions of thermal transport in particulate systems do not accurately account for the effect of interparticle interactions, especially in the intermediate volume fractions of 30–80%. An efficient random network model (RNM) that captures the nearpercolation transport in these particlefilled systems, taking into account the interparticle interactions and random size distributions, was previously developed by Kanuparthi et al. The RNM approach uses a cylindrical region to approximate the thermal transport within the filler particles and to capture the interparticle interactions. However, this approximation is less accurate when the polydispersivity of the particulate system increases. In addition, the accuracy of the RNM is dependent on the parameters inherent in an analytical description of thermal transport between two spherical particles and their numerical approximation into the network model. In the current paper, a novel semispherical approximation to the conductance of the fillers is presented as an alternative to the cylindrical region approximation used earlier. Compared with the cylindrical model, the thermal conductivities of the semispherical model are more closely to the finite element (FE) results. Based on the FE analysis, the network model is improved by developing an approximation of the critical cylindrical region between two spherical particles over which energy is transported. Comparing the RNM results with FE results and experimental data, a linear relationship of the critical parameter with the thermal conductivity ratio and the volume fraction was found that provides a more accurate prediction of the effective thermal conductivity of the particulate TIMs.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
    typeJournal Paper
    journal volume135
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4024392
    journal fristpage31003
    journal lastpage31003
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian