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    Lattice Misfit Stresses in a Circular Bi Material Gallium Nitride Assembly

    Source: Journal of Applied Mechanics:;2013:;volume( 080 ):;issue: 001::page 14505
    Author:
    Suhir, E.
    DOI: 10.1115/1.4007104
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A simple and physically meaningful analytical (“mathematicalâ€‌) predictive model is developed using twodimensional (planestress) theoryofelasticity approach (TEA) for the evaluation of the effect of the circular configuration of the substrate (wafer) on the elastic latticemisfit (mismatch) stresses (LMS) in a semiconductor and particularly in a gallium nitride (GaN) film grown on such a substrate. The addressed stresses include (1) the interfacial shearing stress supposedly responsible for the occurrence and growth of dislocations, for possible delaminations, and for the cohesive strength of the intermediate strain buffering material, if any, as well as (2) normal radial and circumferential (tangential) stresses acting in the film crosssections and responsible for the shortand longterm strength (fracture toughness) of the film. The TEA results are compared with the formulas obtained using strengthofmaterials approach (SMA). This approach considers, instead of the actual circular substrate, an elongated bimaterial rectangular strip of unit width and of finite length equal to the wafer diameter. The numerical example is carried out, as an illustration, for a GaN film grown on a silicon carbide (SiC) substrate. It is concluded that the SMA model is acceptable for understanding the physics of the state of stress and for the prediction of the normal stresses in the major midportion of the assembly. The SMA model underestimates, however, the maximum interfacial shearing stress at the assembly periphery and, because of the very nature of the SMA, is unable to address the circumferential stress. The developed TEA model can be used, along with the author's earlier publications and the (traditional and routine) finiteelement analyses (FEA), to assess the merits and shortcomings of a particular semiconductor crystal growth (SCG) technology, as far as the level of the expected LMS are concerned, before the actual experimentation and/or fabrication is decided upon and conducted.
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      Lattice Misfit Stresses in a Circular Bi Material Gallium Nitride Assembly

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    https://yetl.yabesh.ir/yetl1/handle/yetl/150774
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    contributor authorSuhir, E.
    date accessioned2017-05-09T00:56:00Z
    date available2017-05-09T00:56:00Z
    date issued2013
    identifier issn0021-8936
    identifier otherjam_080_01_014505.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/150774
    description abstractA simple and physically meaningful analytical (“mathematicalâ€‌) predictive model is developed using twodimensional (planestress) theoryofelasticity approach (TEA) for the evaluation of the effect of the circular configuration of the substrate (wafer) on the elastic latticemisfit (mismatch) stresses (LMS) in a semiconductor and particularly in a gallium nitride (GaN) film grown on such a substrate. The addressed stresses include (1) the interfacial shearing stress supposedly responsible for the occurrence and growth of dislocations, for possible delaminations, and for the cohesive strength of the intermediate strain buffering material, if any, as well as (2) normal radial and circumferential (tangential) stresses acting in the film crosssections and responsible for the shortand longterm strength (fracture toughness) of the film. The TEA results are compared with the formulas obtained using strengthofmaterials approach (SMA). This approach considers, instead of the actual circular substrate, an elongated bimaterial rectangular strip of unit width and of finite length equal to the wafer diameter. The numerical example is carried out, as an illustration, for a GaN film grown on a silicon carbide (SiC) substrate. It is concluded that the SMA model is acceptable for understanding the physics of the state of stress and for the prediction of the normal stresses in the major midportion of the assembly. The SMA model underestimates, however, the maximum interfacial shearing stress at the assembly periphery and, because of the very nature of the SMA, is unable to address the circumferential stress. The developed TEA model can be used, along with the author's earlier publications and the (traditional and routine) finiteelement analyses (FEA), to assess the merits and shortcomings of a particular semiconductor crystal growth (SCG) technology, as far as the level of the expected LMS are concerned, before the actual experimentation and/or fabrication is decided upon and conducted.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleLattice Misfit Stresses in a Circular Bi Material Gallium Nitride Assembly
    typeJournal Paper
    journal volume80
    journal issue1
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.4007104
    journal fristpage14505
    journal lastpage14505
    identifier eissn1528-9036
    treeJournal of Applied Mechanics:;2013:;volume( 080 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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