YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Manufacturing Science and Engineering
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Manufacturing Science and Engineering
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Microcutting and Forming of Thin Aluminium Foils for MEMS

    Source: Journal of Manufacturing Science and Engineering:;2011:;volume( 133 ):;issue: 006::page 61015
    Author:
    Christian D. Damsgaard
    ,
    Dennis Mortensen
    ,
    Pirmin Rombach
    ,
    Ole Hansen
    DOI: 10.1115/1.4003810
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a simple procedure for simultaneous cutting and forming of thin Al foils for use in MEMS components. The procedure makes use of scaled down macroscopic sheet forming and cutting techniques by using a hydraulic press, a soft counterpart, and a microfabricated stamp tool. The relation between applied pressure and forming and cutting features has been characterized for a specific set of stamp geometries and boundary conditions. The results show that 10 μm forming features can be transferred to 4 μm thick Al foils, which simultaneously can be cut into products by 25 μm wide cut lines. Using the procedure presented in this paper scaled to full 4–8 in. silicon wafer stamp tools, a fast and adequate method for high volume production of MEMS components is obtained.
    keyword(s): Pressure , Manufacturing , Microelectromechanical systems , Cutting , Metal stamping , Aluminum , Equipment and tools , Semiconductor wafers AND Hydraulic presses ,
    • Download: (1.260Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Statistics

      Microcutting and Forming of Thin Aluminium Foils for MEMS

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/146817
    Collections
    • Journal of Manufacturing Science and Engineering

    Show full item record

    contributor authorChristian D. Damsgaard
    contributor authorDennis Mortensen
    contributor authorPirmin Rombach
    contributor authorOle Hansen
    date accessioned2017-05-09T00:45:21Z
    date available2017-05-09T00:45:21Z
    date copyrightDecember, 2011
    date issued2011
    identifier issn1087-1357
    identifier otherJMSEFK-28500#061015_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/146817
    description abstractThis paper presents a simple procedure for simultaneous cutting and forming of thin Al foils for use in MEMS components. The procedure makes use of scaled down macroscopic sheet forming and cutting techniques by using a hydraulic press, a soft counterpart, and a microfabricated stamp tool. The relation between applied pressure and forming and cutting features has been characterized for a specific set of stamp geometries and boundary conditions. The results show that 10 μm forming features can be transferred to 4 μm thick Al foils, which simultaneously can be cut into products by 25 μm wide cut lines. Using the procedure presented in this paper scaled to full 4–8 in. silicon wafer stamp tools, a fast and adequate method for high volume production of MEMS components is obtained.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleMicrocutting and Forming of Thin Aluminium Foils for MEMS
    typeJournal Paper
    journal volume133
    journal issue6
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.4003810
    journal fristpage61015
    identifier eissn1528-8935
    keywordsPressure
    keywordsManufacturing
    keywordsMicroelectromechanical systems
    keywordsCutting
    keywordsMetal stamping
    keywordsAluminum
    keywordsEquipment and tools
    keywordsSemiconductor wafers AND Hydraulic presses
    treeJournal of Manufacturing Science and Engineering:;2011:;volume( 133 ):;issue: 006
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian