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    Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 003::page 32401
    Author:
    Tengfei Luo
    ,
    John R. Lloyd
    DOI: 10.1115/1.4000047
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol (–S–(CH2)n–S–) molecules. The out-of-plane (z-direction) thermal conductance and in-plane (x- and y-direction) thermal conductivities were calculated. The simulation finite size effect, gold substrate thickness effect, temperature effect, normal pressure effect, molecule chain length effect, and molecule coverage effect on thermal conductivity/conductance were studied. Vibration power spectra of gold atoms in the substrate and sulfur atoms in the SAM were calculated, and vibration coupling of these two parts was analyzed. The calculated thermal conductance values of Au-SAM-Au junctions are in the range of experimental data on metal-nonmetal junctions. The temperature dependence of thermal conductance has a similar trend to experimental observations. It is concluded that the Au-SAM interface resistance dominates thermal energy transport across the junction, while the substrate is the dominant media in which in-plane thermal energy transport happens.
    keyword(s): Temperature , Atoms , Simulation , Equilibrium (Physics) , Thermal conductivity , Electrical conductance , Chain , Junctions , Thickness , Thermal energy transport , Pressure , Vibration , Boundary-value problems AND Molecular dynamics simulation ,
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      Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

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    https://yetl.yabesh.ir/yetl1/handle/yetl/143907
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    contributor authorTengfei Luo
    contributor authorJohn R. Lloyd
    date accessioned2017-05-09T00:39:04Z
    date available2017-05-09T00:39:04Z
    date copyrightMarch, 2010
    date issued2010
    identifier issn0022-1481
    identifier otherJHTRAO-27883#032401_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143907
    description abstractIn this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol (–S–(CH2)n–S–) molecules. The out-of-plane (z-direction) thermal conductance and in-plane (x- and y-direction) thermal conductivities were calculated. The simulation finite size effect, gold substrate thickness effect, temperature effect, normal pressure effect, molecule chain length effect, and molecule coverage effect on thermal conductivity/conductance were studied. Vibration power spectra of gold atoms in the substrate and sulfur atoms in the SAM were calculated, and vibration coupling of these two parts was analyzed. The calculated thermal conductance values of Au-SAM-Au junctions are in the range of experimental data on metal-nonmetal junctions. The temperature dependence of thermal conductance has a similar trend to experimental observations. It is concluded that the Au-SAM interface resistance dominates thermal energy transport across the junction, while the substrate is the dominant media in which in-plane thermal energy transport happens.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEquilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions
    typeJournal Paper
    journal volume132
    journal issue3
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4000047
    journal fristpage32401
    identifier eissn1528-8943
    keywordsTemperature
    keywordsAtoms
    keywordsSimulation
    keywordsEquilibrium (Physics)
    keywordsThermal conductivity
    keywordsElectrical conductance
    keywordsChain
    keywordsJunctions
    keywordsThickness
    keywordsThermal energy transport
    keywordsPressure
    keywordsVibration
    keywordsBoundary-value problems AND Molecular dynamics simulation
    treeJournal of Heat Transfer:;2010:;volume( 132 ):;issue: 003
    contenttypeFulltext
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