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    An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 002::page 21005
    Author:
    D. K. Harris
    ,
    A. Palkar
    ,
    G. Wonacott
    ,
    R. Dean
    ,
    F. Simionescu
    DOI: 10.1115/1.4001745
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study details the fabrication and measurements of a water-filled 5 mm wide by 10 mm long silicon microheat pipe (MHP) array consisting of 22–100 μm square channels. This study is unique in that many experimental results reported in open literature are for single channel microheat pipes. The number of channels in the array and the fluid charge used here were optimized under a separate study. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity and comparisons were made with previous results found in literature. The testing methodology was designed to remove systematic biases and the array thermal performance measurements are reported in terms of a silicon equivalence by identically measuring an uncharged empty silicon array as a baseline measurement. Two separate water-filled specimens were made, independently tested, and are reported to have thermal conductivities of 261 W/m K and 324 W/m K, representing a silicon equivalence of 1.8 and 2.2, respectively. All testing was performed in a horizontal orientation.
    keyword(s): Manufacturing , Thermal conductivity , Pipes , Testing , Silicon , Water , Measurement , Temperature , Channels (Hydraulic engineering) , Fluids , Uncertainty AND Condensers (steam plant) ,
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      An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

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    https://yetl.yabesh.ir/yetl1/handle/yetl/142960
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    contributor authorD. K. Harris
    contributor authorA. Palkar
    contributor authorG. Wonacott
    contributor authorR. Dean
    contributor authorF. Simionescu
    date accessioned2017-05-09T00:37:14Z
    date available2017-05-09T00:37:14Z
    date copyrightJune, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26304#021005_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142960
    description abstractThis study details the fabrication and measurements of a water-filled 5 mm wide by 10 mm long silicon microheat pipe (MHP) array consisting of 22–100 μm square channels. This study is unique in that many experimental results reported in open literature are for single channel microheat pipes. The number of channels in the array and the fluid charge used here were optimized under a separate study. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity and comparisons were made with previous results found in literature. The testing methodology was designed to remove systematic biases and the array thermal performance measurements are reported in terms of a silicon equivalence by identically measuring an uncharged empty silicon array as a baseline measurement. Two separate water-filled specimens were made, independently tested, and are reported to have thermal conductivities of 261 W/m K and 324 W/m K, representing a silicon equivalence of 1.8 and 2.2, respectively. All testing was performed in a horizontal orientation.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
    typeJournal Paper
    journal volume132
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4001745
    journal fristpage21005
    identifier eissn1043-7398
    keywordsManufacturing
    keywordsThermal conductivity
    keywordsPipes
    keywordsTesting
    keywordsSilicon
    keywordsWater
    keywordsMeasurement
    keywordsTemperature
    keywordsChannels (Hydraulic engineering)
    keywordsFluids
    keywordsUncertainty AND Condensers (steam plant)
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 002
    contenttypeFulltext
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