| contributor author | B. Neethi Simon | |
| contributor author | K. Ramesh | |
| date accessioned | 2017-05-09T00:31:16Z | |
| date available | 2017-05-09T00:31:16Z | |
| date copyright | July, 2009 | |
| date issued | 2009 | |
| identifier issn | 0021-8936 | |
| identifier other | JAMCAV-26755#044502_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/139736 | |
| description abstract | Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite element scheme. The stress intensity factors of the interface crack are determined by a multiparameter overdeterministic system of equations in a least-squares sense using the experimental data and by J-integral, numerically. The study showed that a normal temperature variation can lead to significant stresses due to the mismatch of thermal expansion coefficients. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Digital Photothermoelastic and Numerical Analysis of Transient Thermal Stresses in Cracked Bimaterial Interfaces | |
| type | Journal Paper | |
| journal volume | 76 | |
| journal issue | 4 | |
| journal title | Journal of Applied Mechanics | |
| identifier doi | 10.1115/1.3086782 | |
| journal fristpage | 44502 | |
| identifier eissn | 1528-9036 | |
| keywords | Stress | |
| keywords | Thermal stresses | |
| keywords | Fracture (Materials) | |
| keywords | Convection | |
| keywords | Temperature | |
| keywords | Numerical analysis | |
| keywords | Finite element analysis | |
| keywords | Displacement | |
| keywords | Cooling | |
| keywords | Steady state AND Thermal expansion | |
| tree | Journal of Applied Mechanics:;2009:;volume( 076 ):;issue: 004 | |
| contenttype | Fulltext | |