High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure

Abstract

Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si3N4 particle filled epoxy composite with a novel structure was fabricated by a processing method and structure design. Epoxy resin used in particle form was obtained by premixing and crushing. Different particle sizes were selected by sieving. High thermal conductivity was achieved at relative low volume fraction of the filler. The microstructure of the composites indicates that a continuous network is formed by the filler, which mainly completes the heat conduction. Thermal conductivity of the composites increases as the filler content increases, and the samples exhibit a highest thermal conductivity of 1.8W∕mK at 30% volume fraction of the filler in the composites using epoxy particles of 2mm. The composites show low dielectric constant and low dielectric loss.