Various Adhesives for Flip ChipsSource: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001::page 29Author:Z. W. Zhong
DOI: 10.1115/1.1846064Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All the packages passed various reliability tests such as burn in, artificial sweat and humidity tests, and temperature cycling tests. The reliability of the packages was 100% meeting the requirements for an industrial application. A stud bump bonding process with reduced process steps was proposed. Curing of conductive adhesive and underfill epoxy was not required, resulting in reduced packaging time.
keyword(s): Temperature , Adhesives , Manufacturing , Bonding , Reliability , Epoxy adhesives , Flip-chip devices , Flip-chip , Curing AND Packaging ,
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| contributor author | Z. W. Zhong | |
| date accessioned | 2017-05-09T00:15:54Z | |
| date available | 2017-05-09T00:15:54Z | |
| date copyright | March, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26242#29_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131667 | |
| description abstract | Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All the packages passed various reliability tests such as burn in, artificial sweat and humidity tests, and temperature cycling tests. The reliability of the packages was 100% meeting the requirements for an industrial application. A stud bump bonding process with reduced process steps was proposed. Curing of conductive adhesive and underfill epoxy was not required, resulting in reduced packaging time. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Various Adhesives for Flip Chips | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1846064 | |
| journal fristpage | 29 | |
| journal lastpage | 32 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Adhesives | |
| keywords | Manufacturing | |
| keywords | Bonding | |
| keywords | Reliability | |
| keywords | Epoxy adhesives | |
| keywords | Flip-chip devices | |
| keywords | Flip-chip | |
| keywords | Curing AND Packaging | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001 | |
| contenttype | Fulltext |