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    The Challenges of Electronic Cooling: Past, Current and Future

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004::page 491
    Author:
    Richard C. Chu
    DOI: 10.1115/1.1839594
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper represents my personal recapitulation of my 4 decades of continuous involvement in all phases of electronic cooling, from conceptual design, through engineering development to product implementation. The cooling designs that we applied successfully in the past are reviewed chronologically. The challenges we are currently facing are also discussed and an attempt is made to forecast the challenges that will confront the electronics cooling community in the near and distant future. The paper includes a summary of IBM sponsored research spanning a period of 25 years at 12 universities on a wide range of topics related to electronic cooling technology.
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      The Challenges of Electronic Cooling: Past, Current and Future

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    https://yetl.yabesh.ir/yetl1/handle/yetl/129831
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    contributor authorRichard C. Chu
    date accessioned2017-05-09T00:12:40Z
    date available2017-05-09T00:12:40Z
    date copyrightDecember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26239#491_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129831
    description abstractThis paper represents my personal recapitulation of my 4 decades of continuous involvement in all phases of electronic cooling, from conceptual design, through engineering development to product implementation. The cooling designs that we applied successfully in the past are reviewed chronologically. The challenges we are currently facing are also discussed and an attempt is made to forecast the challenges that will confront the electronics cooling community in the near and distant future. The paper includes a summary of IBM sponsored research spanning a period of 25 years at 12 universities on a wide range of topics related to electronic cooling technology.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Challenges of Electronic Cooling: Past, Current and Future
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1839594
    journal fristpage491
    journal lastpage500
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian