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    Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004::page 423
    Author:
    Yoji Kitamura
    ,
    Masaru Ishizuka
    DOI: 10.1115/1.1827256
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: With the rapid increase of the power dissipation density in modern electronic equipment, the cooling design of electronic equipment becomes increasingly important. For widely used forced-convection air-cooled systems, the reliability of and the acoustic noise of the fan present serious concerns as the air velocity is increased to enhance the cooling capacity. Thus, the interest in natural-convection air cooling is growing to take advantage of low noise and energy savings inherent in that cooling mode. One method of promoting the capacity of natural air cooling is to incline the electronics casing, thereby, induce draft air by what is called the chimney effect. However, the effect of inclination on thermal behavior and cooling capacity has not yet been fully understood due to the involvement of many parameters in driving the draft air. This paper presents the results of experimental and numerical studies on the effect of casing inclination on the temperature rise across the casing. The numerical simulation was implemented to find out the thermal behavior inside a thin electronic casing. The simulation results are in good agreement with the experiment data. A thermal design guide is obtained regarding how the cooling effect is improved by increasing the inclination angle.
    keyword(s): Temperature , Cooling , Computer simulation , Electronic equipment , Flow (Dynamics) , Natural convection , Velocity , Density AND Design ,
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      Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

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    https://yetl.yabesh.ir/yetl1/handle/yetl/129821
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    contributor authorYoji Kitamura
    contributor authorMasaru Ishizuka
    date accessioned2017-05-09T00:12:39Z
    date available2017-05-09T00:12:39Z
    date copyrightDecember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26239#423_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129821
    description abstractWith the rapid increase of the power dissipation density in modern electronic equipment, the cooling design of electronic equipment becomes increasingly important. For widely used forced-convection air-cooled systems, the reliability of and the acoustic noise of the fan present serious concerns as the air velocity is increased to enhance the cooling capacity. Thus, the interest in natural-convection air cooling is growing to take advantage of low noise and energy savings inherent in that cooling mode. One method of promoting the capacity of natural air cooling is to incline the electronics casing, thereby, induce draft air by what is called the chimney effect. However, the effect of inclination on thermal behavior and cooling capacity has not yet been fully understood due to the involvement of many parameters in driving the draft air. This paper presents the results of experimental and numerical studies on the effect of casing inclination on the temperature rise across the casing. The numerical simulation was implemented to find out the thermal behavior inside a thin electronic casing. The simulation results are in good agreement with the experiment data. A thermal design guide is obtained regarding how the cooling effect is improved by increasing the inclination angle.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleChimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1827256
    journal fristpage423
    journal lastpage428
    identifier eissn1043-7398
    keywordsTemperature
    keywordsCooling
    keywordsComputer simulation
    keywordsElectronic equipment
    keywordsFlow (Dynamics)
    keywordsNatural convection
    keywordsVelocity
    keywordsDensity AND Design
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
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