A Scalable Multi-Functional Thermal Test Chip Family: Design and EvaluationSource: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004::page 323Author:Zs. Benedek
,
B. Courtois
,
G. Farkas
,
E. Kollár
,
S. Mir
,
A. Poppe
,
V. Székely
,
K. Torki
,
M. Rencz
DOI: 10.1115/1.1389846Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allow a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed such that further “super arrays” can also be built for tiling up larger package cavities. The first members of the family, TMC9 and TMC81, have been manufactured. Our measurements show that the goals aimed at the design have been achieved.
keyword(s): Measurement , Sensors , Design , Temperature , Resistors , Energy dissipation AND Temperature sensors ,
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| contributor author | Zs. Benedek | |
| contributor author | B. Courtois | |
| contributor author | G. Farkas | |
| contributor author | E. Kollár | |
| contributor author | S. Mir | |
| contributor author | A. Poppe | |
| contributor author | V. Székely | |
| contributor author | K. Torki | |
| contributor author | M. Rencz | |
| date accessioned | 2017-05-09T00:04:33Z | |
| date available | 2017-05-09T00:04:33Z | |
| date copyright | December, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26198#323_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125011 | |
| description abstract | Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allow a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed such that further “super arrays” can also be built for tiling up larger package cavities. The first members of the family, TMC9 and TMC81, have been manufactured. Our measurements show that the goals aimed at the design have been achieved. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1389846 | |
| journal fristpage | 323 | |
| journal lastpage | 330 | |
| identifier eissn | 1043-7398 | |
| keywords | Measurement | |
| keywords | Sensors | |
| keywords | Design | |
| keywords | Temperature | |
| keywords | Resistors | |
| keywords | Energy dissipation AND Temperature sensors | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004 | |
| contenttype | Fulltext |