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    Estimating the Location and Depth of Normal Cracks in Cantilevers From Holographic Fringe Patterns

    Source: Journal of Engineering Materials and Technology:;1999:;volume( 121 ):;issue: 003::page 399
    Author:
    S. Qin
    ,
    H. M. Shang
    ,
    Q. H. Leong
    ,
    C. E. Tee
    DOI: 10.1115/1.2812393
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two parameters that are linearly related for a crack-free cantilever but cease to be so when a crack is present, are derived. A simple procedure for detecting the crack and assessing its location and depth is subsequently described.
    keyword(s): Diffraction patterns , Fracture (Materials) AND Cantilevers ,
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      Estimating the Location and Depth of Normal Cracks in Cantilevers From Holographic Fringe Patterns

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    https://yetl.yabesh.ir/yetl1/handle/yetl/122214
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    contributor authorS. Qin
    contributor authorH. M. Shang
    contributor authorQ. H. Leong
    contributor authorC. E. Tee
    date accessioned2017-05-08T23:59:46Z
    date available2017-05-08T23:59:46Z
    date copyrightJuly, 1999
    date issued1999
    identifier issn0094-4289
    identifier otherJEMTA8-26999#399_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/122214
    description abstractTwo parameters that are linearly related for a crack-free cantilever but cease to be so when a crack is present, are derived. A simple procedure for detecting the crack and assessing its location and depth is subsequently described.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEstimating the Location and Depth of Normal Cracks in Cantilevers From Holographic Fringe Patterns
    typeJournal Paper
    journal volume121
    journal issue3
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2812393
    journal fristpage399
    journal lastpage401
    identifier eissn1528-8889
    keywordsDiffraction patterns
    keywordsFracture (Materials) AND Cantilevers
    treeJournal of Engineering Materials and Technology:;1999:;volume( 121 ):;issue: 003
    contenttypeFulltext
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