Micromachining in Plastics Using X-Ray Lithography for the Fabrication of Micro-Electrophoresis DevicesSource: Journal of Biomechanical Engineering:;1999:;volume( 121 ):;issue: 001::page 13DOI: 10.1115/1.2798035Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Micromachining was performed in polymethylmethacrylate (PMMA) using X-ray lithography for the fabrication of miniaturized devices (microchips) for potential applications in chemical and genetic analyses. The devices were fabricated using two different techniques: transfer mask technology and a Kapton® mask. For both processes, the channel topography was transferred (1:1) to the appropriate substrate via the use of an optical mask. In the case of the transfer mask technique, the PMMA substrate was coated with a positive photoresist and a thin Au/Cr plating base. Following UV exposure, the resist was developed and a thick overlayer (∼3 μm) of Au electroplated onto the PMMA substrate only where the resist was removed, which acted as an absorber of the X-rays. In the other technique, a Kapton® film was used as the X-ray mask. In this case, the Kapton® film was UV exposed using the optical mask to define the channel topography and following development of the resist, a thick Au overlayer (8 μm) was electrodeposited onto the Kapton® sheet. The PMMA wafer during X-ray exposure was situated directly underneath the Kapton® mask. In both cases, the PMMA wafer was exposed to soft X-rays and developed to remove the exposed PMMA. The resulting channels were found to be 20 μm in width (determined by optical mask) with channel depths of ∼50 μm (determined by x-ray exposure time). In order to demonstrate the utility of this micromachining process, several components were fabricated in PMMA including capillary/chip connectors, injectors for fixed-volume sample introduction, separation channels for electrophoresis and integrated fiber optic fluorescence detectors. These components could be integrated into a single device to assemble a system appropriate for the rapid analysis of various targets.
keyword(s): Electrophoresis , Manufacturing , X-ray lithography , Micromachining , Plastics , Masks , Channels (Hydraulic engineering) , X-rays , Ultraviolet radiation , Semiconductor wafers , Ejectors , Integrated circuits , Fluorescence , Separation (Technology) , Photoresists , Plating , Fibers AND Sensors ,
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| contributor author | S. M. Ford | |
| contributor author | C. K. Malek | |
| contributor author | J. Davies | |
| contributor author | B. Kar | |
| contributor author | S. D. Qi | |
| contributor author | S. McWhorter | |
| contributor author | S. A. Soper | |
| date accessioned | 2017-05-08T23:59:03Z | |
| date available | 2017-05-08T23:59:03Z | |
| date copyright | February, 1999 | |
| date issued | 1999 | |
| identifier issn | 0148-0731 | |
| identifier other | JBENDY-26012#13_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121830 | |
| description abstract | Micromachining was performed in polymethylmethacrylate (PMMA) using X-ray lithography for the fabrication of miniaturized devices (microchips) for potential applications in chemical and genetic analyses. The devices were fabricated using two different techniques: transfer mask technology and a Kapton® mask. For both processes, the channel topography was transferred (1:1) to the appropriate substrate via the use of an optical mask. In the case of the transfer mask technique, the PMMA substrate was coated with a positive photoresist and a thin Au/Cr plating base. Following UV exposure, the resist was developed and a thick overlayer (∼3 μm) of Au electroplated onto the PMMA substrate only where the resist was removed, which acted as an absorber of the X-rays. In the other technique, a Kapton® film was used as the X-ray mask. In this case, the Kapton® film was UV exposed using the optical mask to define the channel topography and following development of the resist, a thick Au overlayer (8 μm) was electrodeposited onto the Kapton® sheet. The PMMA wafer during X-ray exposure was situated directly underneath the Kapton® mask. In both cases, the PMMA wafer was exposed to soft X-rays and developed to remove the exposed PMMA. The resulting channels were found to be 20 μm in width (determined by optical mask) with channel depths of ∼50 μm (determined by x-ray exposure time). In order to demonstrate the utility of this micromachining process, several components were fabricated in PMMA including capillary/chip connectors, injectors for fixed-volume sample introduction, separation channels for electrophoresis and integrated fiber optic fluorescence detectors. These components could be integrated into a single device to assemble a system appropriate for the rapid analysis of various targets. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Micromachining in Plastics Using X-Ray Lithography for the Fabrication of Micro-Electrophoresis Devices | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 1 | |
| journal title | Journal of Biomechanical Engineering | |
| identifier doi | 10.1115/1.2798035 | |
| journal fristpage | 13 | |
| journal lastpage | 21 | |
| identifier eissn | 1528-8951 | |
| keywords | Electrophoresis | |
| keywords | Manufacturing | |
| keywords | X-ray lithography | |
| keywords | Micromachining | |
| keywords | Plastics | |
| keywords | Masks | |
| keywords | Channels (Hydraulic engineering) | |
| keywords | X-rays | |
| keywords | Ultraviolet radiation | |
| keywords | Semiconductor wafers | |
| keywords | Ejectors | |
| keywords | Integrated circuits | |
| keywords | Fluorescence | |
| keywords | Separation (Technology) | |
| keywords | Photoresists | |
| keywords | Plating | |
| keywords | Fibers AND Sensors | |
| tree | Journal of Biomechanical Engineering:;1999:;volume( 121 ):;issue: 001 | |
| contenttype | Fulltext |